We have been able to see the first delid of an Intel Basins Falls processor at Computex 2017, verifying that the die is not welded to the IHS, that it uses thermal paste, something that can be a real problem.

Intel Basins Falls processors are giving a lot to talk about at Computex 2017. We know that these processors are based on the Skylake-X and Kaby Lake-X architecture and we have learned something else thanks to the prestigious der8auer overclocker, which has opened the first processor Intel Core i9 7900X, which has an IHS that is not soldered to the die of the processor itself, which is the first time this has occurred in the extreme and enthusiastic Intel platform, which could affect the dissipation of the temperature if or a good thermal paste is integrated.

Intel seems to have put thermal paste again, we hope not of such low quality as in the Kaby Lake, whose maximum representation, the i7 77700K has temperature problems, not recognized by Intel, but it is like that, it goes full blast with barely opening the browser due to poor thermal paste. Having a thermal paste in high-end processors as in this case can lead to an increase in the working temperature, since this paste has a poorer heat transfer than solder.

The IHS can be removed to improve the conductive paste and thus lower the temperature of the processor or, something that we do not recommend, put the die and the cooler directly in contact. This practice is not recommended at all, since the silicon of the die is extremely delicate and if we press too much we will break the processor, that is why the IHS was put, to protect the silicon and prevent that when installing the heatsink we break the processor. Until the first analyzes arrive (hopefully we can do one), we will not be able to say if they are a good solution or not and the temperature at which they work.

Source: OC3D