Intel Basins Falls motherboard manufacturers are solving VRM temperature problems

Manufacturers would be solving the temperature problems of high-end motherboards for Intel Basins Falls processors, after reports of temperature problems.

After the first complaints from some users about the temperature of the VRMs, which in theory, in some motherboards reach 100ºC, when an Intel Basins Falls processor of Intel LGA 2099 socket is installed. The heatsinks that arrive Assembled from the factory, they have a fairly limited heatsink, which when overclocking the processors, causes the scarcity and limitation of the VRMs, causes the current to pass with them and the temperature rises significantly, increasing losses.

ASUS, who seems to have the biggest temperature problems, would be working on improving the heat dissipation of the heatsinks on the ASUS X299 RoG Rampage VI APEX motherboard. The modification is based on a small aluminum heatsink that is fixed to the VRMs themselves and that dissipates heat through a small fan, which adheres to the aluminum block, located in the upper area of ​​the rear panel, joined by a heatpipe of copper.

According to the der8auer overclocker, the ASUS X299-A, the ASUS Strix X299-E Gaming and the MSI X299 Gaming Pro Carbon reach 105ºC, while the ASUS X299 RoG Rampage VI Apex reaches 110ºC, but it seems to be, according to our data, that Gigabyte motherboards have fewer problems in this regard. It should be noted that temperature problems occur with extreme overclocking, when the processor consumes much more, especially when it goes above 5.0GHz. The der8auer himself has acknowledged that he has not been able to verify so far if the new heatsink solves the problem.

Manufacturers have gotten the message and are working to fix the problem, with an upgrade to the onboard heatsinks. The problem, if we compare it with the number of VRM phases installed in the high-end Kaby Lake boards, we see that the difference is very large, which is causing the problems, along with inefficient heatsinks, since the design than efficiency in dissipation.

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