It was revealed today that TSMC may have delayed its 3nm lithography process due to the coronavirus. The reason isn't technical problems in the lithography development itself, but rather difficulties in assembling the necessary machinery. We now know that TSMC and AMD have been working on developing a lithography process exclusively for AMD solutions, which is superior to 5nm.
It appears that AMD and TSMC have worked on an improved 5nm lithograph over the commercial version from the Taiwanese foundry. Something that guarantees us that next year we could see Zen4 processors and RDNA3 graphics cores. Logically who has to be concerned about this is Intel, which urgently needs its 10nm lithography.
[amazon box="B07STGGQ18"]TSMC has created a lithograph just for AMD
TSMC is said to have developed an improved version of its 5nm manufacturing process specifically for AMD, which has a capacity requirement of no less than 20.000 12-inch wafers per month.
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Recall that the N5P lithographic process could be delayed for about six months. This advanced lithography, an advanced version of this node, improves density 84-87% over the 7nm process.
Apple and Huawei will be the first beneficiaries in TSMC's 5nm lithography, because lithography is not yet ripe to make large silicon. This enables TSMC to further diversify its portfolio and meet today's high demands for AMD chips. Note that Ryzen, Threadripper and EPYC processors are in high demand and RDNA2 is expected to be in high demand.
Developing a specific lithography for your processors and graphics could lead to an improvement in the IPC. We suppose that more data will be known later, who knows if AMD will reveal data to us when the world returns to normal, be that when it is.
Source: PCGN
