In an interview with Barron's, Dr. Lisa Su, CEO of AMD, has stated that for AMD; Moore's Law is not dead, but it has slowed down. As she says, you have to do things differently to overcome the challenges of performance, efficiency and cost. She believes that chiplets and 3D Packaging are the solutions her company has invested in, and that there is much more on the way.
They will launch their MI300, an exa-scale APU that combines multiple CPUs, GPUs, and memory IPs across several chiplets and 3D dies in a single package . This is a large chip for AMD's foray into the artificial intelligence segment later this year.
This is what the future holds for AMD
Lisa also mentioned that despite rising costs and reduced performance from generation to generation at each transition process node, they will continue to move forward. They are already working with 3nm nodes and studying 2nm and beyond. In a similar strategy, this would lead to the Angstrom or subnm era, which on the Intel side starts at 20A and 18A.
Currently, AMD has products using 5nm and 4nm process nodes, with some 6nm and 7nm products in between. Starting next year, they are expected to introduce their first 3nm chips , which would initially target the server sector before being rolled out to consumers or professionals.
Many companies have deferred orders for products based on TSMC's 3nm node, due to current market conditions. AMD is among them. With all this, it has been seen before that they already have in development or at least planning, the generations of Zen 5 and Zen 6 CPU cores. Some of these could use these 3nm or even 2nm processes, but they would have to first. Confirm them by AMD, after seeing if they can use them if market and supply chain conditions improve.
Source: Wccftech
