Intel Lakefield is officially announced, manufactured in Foveros 3D

The launch of the new Intel Lakefield processors has just been announced. These new Intel Core processors make use of proprietary Intel Hybrid technology. The new Lakefield processors are on a mission to compete with ARM architecture Qualcomm Snapdragon processors. They are based on a hybrid processor design that uses the Foveros package that allows the development of new lighter and more compact equipment.

The new Intel Lakefield processors are based on 10nm lithography and the Foveros packaging system. This allows Lakefield processors to have a footprint of just 12x12x1mm and a lower package height than previous generations. Specifically, the size of the set has been reduced by 56% and the height by 47%.

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Intel Lakefield Processors Officially Announced

These new processors, based on 10nm, are presented as an improved solution to offer more autonomy in laptops. These Intel Lakefield processors have a consumption of 2.5mW in standby mode, which represents a reduction in consumption of 91% compared to the Core-Y. Additionally, these processors have been built with dual-screen systems in mind.

Intel Lakefield Features

• Smaller CPU size through Foveros: Using Foveros 3D stacking technology, the package size has been drastically reduced. It has dimensions of 12x12x1mm, which is the size of about a US penny. Two logical arrays and two DRAM layers can be stacked in three dimensions, eliminating the need for external memory.
• Hardware-Guided Operating System Programming: It enables real-time communication between the processor and the operating system programmer. This allows the right applications to run on the right cores. This hybrid architecture offers up to 24% more performance and up to 12% more performance in whole process applications than a single thread
• More than 2x Intel UHD performance on AI-enhanced workloads: Flexible GPU computing enables high-performance, sustained interference applications, including AI-enhanced video stabilization, image resolution scaling and analysis.
• Up to 1.7x improvement in graphics performance: Gen11 graphics offer seamless media and branded content creation. The biggest graphical leap for Intel systems with 7-watt processors. Convert video clips up to 54% faster and has support for four external 4K displays.
• Gigabit connectivity: Support for Intel WiFi 6 (Gig +) and Intel LTE

New Lakefield Specifications

Source: MSP