The Intel B365 chipset based on 22nm will hit the market on January 16

All the characteristics of the Intel B365 chipset have been revealed, which should arrive on January 16 with almost no presentation.

It is well known that Intel for some months has serious problems to supply the market with processors. The company has too much range of processors based on 14nm and its plants do not give more of themselves. Going to 10nm is not something viable at the moment because it is a lithograph that is not ready yet. This problem of more demand than supply has led Intel to activate plants that manufactured other components. It has also forced to revive the 22nm lithography for chipsets and outsource some processors.

The Intel B365 chipset will hit the market on January 16

It will not be a chipset with a great presentation, we can say that it will arrive, period. The Intel B365 is designed for eighth and ninth generation processors and LGA 1151 socket boards. Said chipset will come with some improvements, but minimal and will leave the B360 as discontinued.

The structure of this chipset is curiously based on the H270. The H270 and B365 specifications are the same but differ in that this new chipset is 22nm lithography. This is done to release a bit of the 14nm lithography used in the B360 chipset.

According to the technical data, it will have Dual Channel support for DDR4 RAM, it will have 20 PCIe 3.0 lanes supporting x1 / x2 / x4 configurations. It has support for 14 USB 3.0 / 2.0 ports. It has support for 6 SATA 6.0Gbps ports and PCIe 0/1/5 and SATA 0/1/5/10 RAID configurations. It does not include Wireless connectivity and has a 6W TDP.

This chipset will not allow overclocking, since this function is not enabled the same as it was not in the B360. According to the data, this B365 chipset will also have a price of about $ 28, somewhat less than the H270 that had a cost of $ 32.

Source: Mydrive