The Intel LGA 1200 socket will be compatible with the heatsinks for the LGA 115X socket

The next generation of Intel processors will come with a new socket because more pins have been added. Little else we know about this new socket, or did we know, since the design of the LGA 1200 socket has been leaked. This new socket would have the characteristic of being compatible with heatsinks for the LGA 115X socket, something that is appreciated.

Lately Intel is being criticized enough for the socket change, since it will force a motherboard change. AMD offers the AM4 socket for 4 generations of processors, only needing to update the BIOS. Intel with each generation, despite being the same socket, forces to change motherboard, something that users do not like.

New Intel LGA 1200 socket design leaked

It was momomo_us, who has already successfully filtered other processor data, has shown images of the new socket. It appears that the LGA 1200 is identical in dimensions to the LGA 1151 socket. This allows current heatsinks for Intel processors to be fully compatible. So despite the increase in pins, the dimensions will be the same.

In this way we should simply make sure that the heatsink has enough capacity to dissipate heat from CPU. Who would manufacture this new socket would be Foxconn, the same company that has been manufacturing them for years.

A leak that has also been possible thanks to eUUUK50, who has also revealed the socket. Apparently Intel hasn't changed the size of the contacts. We can see an empty piece in the substrate where the DIE of the processor is integrated, which is used to add the 49 additional pins.

Remember that this socket will be used for Come Lake processors, the 10th Gen Intel Core processors. These processors will arrive with new motherboards inevitably and the Intel 400 Series chipset. The launch will be in 2020, but we don't know when.

Source: TPU