Intel Comet Lake-S will have temperature problems and concerns manufacturers
The release of Intel Comet Lake-S processors has been steadily delayed without an official explanation. Despite the many rumors regarding the launch of these processors, there is nothing confirmed by Intel. Comet Lake-S is characterized by having up to 10 cores and 20 threads based on 14nm lithography, which we already know will be a problem.
These Intel processors will have to fight with the AMD Ryzen 3000 processors of Zen2 @ 7nm architecture. AMD currently offers more cores, lower power consumption, lower temperatures, and lower price. These Comet Lake-S processors from Intel seem no match for AMD processors on any of the points mentioned.
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Thermal problems of the Intel Comet Lake-S
Comet Lake-S, as we said, is based on 14nm lithography, which no matter how refined it is, it is still 14nm. The possibility of improvements with this lithography is nil, only more and more cores can be embedded in a DIE, increasing consumption and temperature. These new processors with no architectural changes or no enhancements, aim to have very little to do with AMD processors.
The increase in energy consumption of increasing the number of cores, not surprisingly, generates more heat. It will force heatsink manufacturers to launch more robust solutions. For the Core i9, with 10 cores, the most advanced air-cooled heatsinks from Corsair, Noctua, BeQuiet! or Cooler Master or jump to the RL AIO.
Not only the problem lies in the temperatures, the manufacturers of motherboards will also have their problems. Developing motherboards with a large number of VRM phases and that they are well cooled will not be easy. Supporting 10-core processor based on the 14nm architecture is not easy.
You just have to see the leak of the Core i9-10900F review, which suggests a TDP PL1 of 170W and a TDP PL2 of 225W. We are talking about energy consumption and therefore, a heat generation is a real stupidity.
All of these factors, it seems, are putting heatsink and motherboard manufacturers under strain. Motherboard manufacturers fear increased warranty processing due to VRM issues. A lot of problems to come with the Intel Comet Lake-S.
Source: OC3D
Intel Venus Lake should be called.
I understood that reference (ㆁ ω ㆁ) hehe.
You mean the same problems that the board manufacturers had with the Ryzen 300 and the need for active cooling? Like those plates that burned because the VRMs couldn't cope? Ahh that we no longer remember. And that concern of the manufacturers, have they communicated it to you personally? Because in the article that you have made almost cutter it does not say anything about worried manufacturers. Go that the only thing you have added as an author is an invented one, send flats
1. I think you are confusing the active cooling of the chipset with the VRM phase system. The VRM phases are to the left of the socket and the chipset is to the bottom right of the motherboard. Some high-end overclocking may have active VRM dissipation, but most do not.
2. Is there more RMA than normal? Also some RTX 2080s died at first due to a problem in the memories.
3. Well, man, I have contact with motherboard manufacturers and they talk about things from time to time, but names are always avoided.
4. What data have I made up? Everything is based on all the data that has been known so far.
The point has come when Intel's nonsense has no possible justification. They need to react now, because the Comet Lake-S are junk compared to the Ryzen 3000, realistically. The Ryzen 3000 are cheaper, perform the same or more in games and let's not talk about specific tasks that depend on the number of cores and threads, they are much more efficient and do not have temperature problems. Maybe the Ryzen 9 3950X and Ryzen 9 3900X might need more powerful heatsinks, but still they laugh at 14nm