Intel Foundry Services and Arm have announced a multi-generation agreement that will allow them to create low-power computing system-on-chips (SoCs) in the process. Intel 18A. The collaboration will focus first on mobile embedded system-on-chip designs, and expects to expand into automotive, Internet of Things, data centers, aerospace and government applications.
Arm customers will benefit from Intel 18A process technology, which offers new transistor technologies to improve power and performance. As part of its IDM 2.0 strategy, Intel is investing in leading-edge manufacturing capabilities around the world, including significant expansions in the United States and the European Union. In this way they hope to meet the sustained demand for chips in the long term.
Arm joins Intel to improve technology in SoC and other sectors
This collaboration will enable a more balanced global supply chain for customers working on mobile soC design on Arm-based CPU cores. Arm partners will be able to take full advantage of Intel's open system foundry model. What Intel is offering to this union goes beyond traditional wafer manufacturing to include packaging, software and chiplets.
IFS and Arm will conduct Joint Design Technology Optimization in which chip process and design technologies are optimized together to improve the power, performance, area, and cost (PPAC) of Arm cores targeting the Intel 18A process technology. For its part, the Intel 18A process offers PowerVia for optimal power delivery and the RibbonFET gate all around (GAA) IFS transistor architecture. Arm will develop a mobile reference design that will demonstrate knowledge of software and systems to foundry customers.
As the industry evolves from DTCO to Systems Technology Co-Optimization (STCO), Arm and IFS will work together to optimize platforms from applications and software to packaging and silicon, leveraging the unique foundry model of Intel Open Systems.
