SK Hynix presents the HBM2E that offer a bandwidth of 460GB/s and 16GB per stack
Introduced by SK Hynix the new HBM2E memories, which has caused rumors to appear indicating that they could be used in AMD RDNA 2.
One of the most important characteristics of the RDNA architecture, is that it no longer depends so much on memory bandwidth. This architecture developed by AMD eliminates the need for HBM2, which makes the final product more expensive. GDDR6 memories are cheaper and offer great performance. But now SK Hynix has announced the new HBM2E memories, which offer high bandwidth.
This has sparked rumors that AMD could use these memories in Navi 23-based Radeon RXs. The company's upcoming RDNA 2-based silicones could, according to rumor, swap out GDDR6 memories for HBM2E ones. Something that would not seem logical, since the price of the product is quite expensive. Surely they stay for the professional segment.
SK Hynix presents the new HBM2E memories
These new memories would offer 50 percent more bandwidth than HBM2 memories and would double the capacity. The new memories will offer a bandwidth of 460Gb / s. They will also offer a throughput of 3.6Gbps per pin with 1 inputs / outpus. They use Trought Silicon Vía technology that allows vertical stacking of 024 floors of 8 gigabits, which offers that each stack has 16GB of capacity.
The foundry indicates that the HBM2Es "are an optimal memory solution for the fourth industrial age, supporting high-end GPUs, supercomputers, machine learning and artificial intelligence systems that require the highest level of memory performance."
Unlike more basic DRAM products, which adopt a design in the form of independent modules and are mounted on PCBs, the HBM chip is closely interconnected with processors such as the GPU and logic chips, spaced only a few units of µm apart, thus which enables even faster data transfer. "
"SK Hynix has established its technological leadership since its first launch of HBM in the world in 2013," said Jun-Hyun Chun, Head of Commercial Strategy at HBM. "SK Hynix will begin mass production in 2020, when it is expected that the market for HBM2E memory opens, and it will continue to strengthen its leadership in the premium DRAM memory market "
Source: TPU
