TSMC could experience delays in the 3nm lithography, than initially expected

The coronavirus is causing significant problems worldwide, paralyzing all kinds of industries. The technology industry has experienced some difficulties, particularly Foxconn , which had to halt production. Production lines for the 5nm process appear to be proceeding as planned, and 7nm production has also not been delayed. The problem for the TSMC foundry seems to lie with its 3nm process.

According to different sources, TSMC has reached the maximum wafer production capacity based on 5nm. Due to the coronavirus and that they have focused on 5nm, chip production based on 3nm could take longer to arrive. Sources indicate that the 3nm delay will be at least 3 months.

TSMC looks like it will have delays on 3nm lithography

Sources indicate that the delay in 3nm production was due to the inability to update the machinery necessary for production. A difficulty that is given by the limitations caused by the coronavirus. This factor is preventing the company from having access to the necessary equipment for the manufacture of 3nm wafers.

It is not just a TSMC thing, Samsung would also be experiencing delays. The delays of both companies assume that 3nm, in both cases, would not arrive until 2022, focusing at the moment on 5nm production.

The N5P node (improved version of 5nm) according to the Taiwanese foundry, has achieved a significant improvement in the density of transistors. The company indicates an 84-87% improvement in density over the first version of the 7nm node.

Note that TSMC expects to start producing chips under the N5P node later this year. Regarding the lithography of N5 (5nm) it should already be in production or at most it should start production in May. This will allow us to see the first chip devices based on this lithograph in Apple and Huawei devices by the end of the year.

Source: wccftech