AMD motherboard manufacturing partners such as ASUS, MSI, ASRock, Gigabyte and Biostar have revealed more details about their X670E platform designs for Ryzen 7000 desktop CPUs. AMD Ryzen 7000 CPUs will migrate to a familiar new home as AM5, successor to the AM4 platform.
This marks a new beginning for the Ryzen desktop family, and as such, existing Ryzen CPUs, from the Ryzen 1000 series up to the Ryzen 5000 series, will not be compatible with the new platform . The AM5 platform will primarily feature the new LGA 1718 socket, meaning AMD is no longer pursuing the Pin Grid Array approach but is now focusing on Land Grid Array, similar to the one Intel uses in its current desktop processors.
This will be the first motherboards for AM5
The main reason for switching to LGA is the inclusion of improved, next-generation features like PCIe Gen 5 and DDR5 RAM . The socket has a single locking mechanism, eliminating the need to worry about damaging the pins under the processor when making a connection.
Representatives from each of the motherboard manufacturers joined the latest live stream of AMD's " Meet The Experts " program to discuss their next-generation X670E designs. Details regarding overclocking and memory compatibility are still lacking. The full product lineup announcement is just a few weeks away, specifically on August 29th, with a launch planned for August 15th.
ASUS has been the first to introduce its high-end motherboards ROG Crosshair X670E Extreme and ROG Crosshair X670E HERO. They will come with 20+2 stages for the Extreme and 18+2 stages for the HERO models. Both models are designed with 110 A power stages and a team design. The VCore PWM controller is an Infineon ASP2205 while the power stages are based on Vishay's SIC850. Other standout features include WiFi 6E, Marvell AQC113CS 10GbE connectors, PCIe x16 Gen 5.0 and M.2, USB 4 ports, and Quick Charge 4+.
MSI will launch four new X670E motherboards under its MEG, MPG and PRO lines. The VRM configuration of MSI X670E motherboard is as follows:
- MEG X670E GODLIKE – 24 (105A) + 2 + 1
- MEG X670E ACE – 22 (90A) + 2 +1
- MPG X670E Carbon – 18 (90A) + 2 +1
- PRO X670E-P WiFi – 14 (80A) + 2 +1
It has also featured high-end heatsinks like screwless M.2 Shield Frozr technology, M.2 XPANDER-Z Gen 5 Dual AIC that supports up to two PCIe Gen 5.0 x4 SSDs in one active cooling solution; 60W USB Type-C Power Delivery and more robust power delivery for each motherboard level.
Source: Wccftech
