With the arrival of Intel Alder Lake CPUs and their new surface design for heatsinks, motherboards rely on the new LGA 1700 socket. Many users are going to make the leap to Intel Alder Lake, and therefore require adapters to LGA 1700 to the heat dissipation of the coolers that are available in the market as the case of the manufacturer XPG.
The idea is simple: allow users to continue using the cooling systems already available on their PCs before making the leap to Alder Lake with a new CPU and motherboard. Many refrigeration system manufacturers have been announcing these plans to bring new adapters to consumers, and XPG is the latest to do so.
XPG gives you the mounting kit for LGA1700 of its AIO coolers
Manufacturer XPG, a fast-growing provider of systems, components and peripherals for gamers, e-sports professionals and technology enthusiasts, has announced the availability of the free LGA 1700 mounting kit for its All In One LEVANTE 240 liquid coolers and LEVANTE 360 for free. This will allow users to use their current XPG coolers with the new 12th Gen Intel Alder Lake CPUs.
Both XPG LEVANTE 240 and LEVANTE 360 are compatible with the new Intel LGA 1700 socket. The new mounting kit will be available free of charge. To achieve this, you have to request validation on the page of XPG Customer Support with proof of purchase of XPG coolers, CPU and / or 12th generation motherboard. After that, XPG Customer Service will contact users with their free LGA1700 mounting kit and further instructions. The duration of the delivery depends on the location of the client and only the materials necessary for the installation of the same will be sent.
