JEDEC announces that it has officially finished development of UFS 3.0, which allows doubling the bandwidth with respect to UFS 2.0 and that it will still take some time to reach the market.

Not only do the USB ports of computers need updates and improvements, but also the connectors of other terminals, such as those of smartphones. JEDEC, an organization that is responsible for the development of new standards within the field of microelectronics, has announced the launch of the new standard UFS 3.0. This new technology provides a new solution for the internal and external storage of smartphones, which promises to multiply by two the bandwidth, offered by the UFS 2.1 format. In addition to improving bandwidth, consumption is reduced, thus increasing the autonomy of the terminal.

These new UFS 3.0 chips are a better solution in terms of storage, making it more efficient, using two channels that allow reaching a bandwidth of 23.2Gbps, compared to the 11.6Gbps offered by the current UFS 2.1 standard, that only operates on a single channel. The consumption goes from the 2.7-3.6V of the UFS 2.1 system to the 2.5V of the UFS 3.0, despite doubling the bandwidth.

Durability is a very important aspect and this type of memory offers greater longevity, in addition to withstanding even more extreme temperatures, being able to operate between -40ºC and reach up to 105ºC. This will also allow it to be implemented in autonomous vehicles and improves reliability against errors in the hosted data. The UFS 3.0 technology also offers speeds close to that of SSDs, which is impressive.

Although this solution is already developed, the start of mass production and the development of terminals that implement this technology are still missing, something that can take between ten or twelve months, at least.