Professional overclocker der8auerk talks about extreme temperatures of VRM phases on Intel Basins Falls motherboards with X299 chipset, due to poor heatsink design.
The last two families of Intel processors (Kaby Lake and Basins Falls), have entered the market on the wrong foot, especially in the thermal aspect, which have a high temperature. A benchmark in overclocking, such as der8auer, has uploaded a video on his YouTube channel talking about the problems of Intel's new platform with LGA 2066 socket, which comes with the Intel X299 chipset. You have commented that it is quite a serious problem to keep the VRM MOSFETs well cooled.
Above all, the complaint comes from the heat dissipation and is that the brands prioritize the aesthetics of the motherboard instead of the correct cooling of the system, not looking for functionality. Despite using thermal pads, temperatures are still through the roof. Der8auer has highlighted that in the Gigabyte Aorus X299 Gaming 3, temperatures of between 84.2ºC and 105.9ºC are marked, noting that the heatsinks installed on the motherboard are quite insufficient to keep the temperature of the MOSFETs at bay. He has highlighted that the ASUS X299 Prime Deluxe motherboard is even more pitiful, since those temperatures are reached within ten minutes.

This is a serious problem, because the motherboard could break, although the MOSFETs tend to withstand high temperatures, the wear is great, causing the breakage of these or the processor in the event of a malfunction. The other aspect is the inefficiency that this causes. We must bear in mind that this extreme heat causes the current that passes through the MOSFETs to transform into heat and therefore, it is lost, so that there could be drops in the power supply of the processor and cause blue screens or worse.
Furthermore, der8auer explains that with a very simple overclocking of 4.6GHz and a voltage of 1.2V, something very discreet in a 24/7 overclocking is crazy. A reading measured 105.9ºC has been detected on the back of the motherboard, so the MOSFET would be even hotter, hovering around 120ºC. The temperature difference is the PCB, which insulates it slightly and dissipates the heat a bit through the rest of the motherboard. The overclocker explains that he went to the Prime95's quarter of an hour, without AVX load, but with AVX load, the temperatures would be even more extreme.
Gigabyte for its part uses the same VRM design in its three X299 boards (currently), so it all depends on the heatsink, which does not do its job efficiently, causing the opposite effect, even. It seems that all motherboards have been poorly developed for overclocking, but it is not the only problem. Der8auer clarifies that with a 120mm fan the problem is solved, as long as we point directly at the heatsink, even specifically that by removing the heatsink, the VRMs dissipate perfectly with the 120mm fan pointing directly.

According to der8auer, the consumption of the Skylake-X consumes too much for a single 8-pin connector, which would be the origin of the temperature problem, even causing the coating of the cables to melt (the coating is usually thermoplastic, withstanding a maximum temperature 70 ° C). The overclocker stands out that the 8-pin cable reaches 65ºC outdoors, inside a chassis, with the heat that it does in summer, it could reach 80-90ºC, which is a very serious problem. It is for this reason that der8auer recommends against using X299 motherboards with a single 8-pin connector.
It should be noted that it is not a brand, it seems that it affects all brands on the market, be it Gigabyte ASUS, MSI, ASRock, etc. In addition, the der8auer itself specifies that the ASUS X299 Prime has two 8 + 4-pin connectors and it overheats, so it recommends not buying it to avoid disappointment.
what are the VRM phases
The VRM phases are the chip feeds. In this case it is on top of the processor, between the DIMM slots. Basically what they do is regulate the power supply to the processor cores, making it stable and avoiding system crashes. It seems that they have an excess of temperature because they do not have a good heatsink. I mark it in red. https://uploads.disquscdn.com/images/463141eb89dc39bdf5b486b80103414210b9360befa19085568d2794b377f231.jpg
"It seems that they have excessive temperatures due to not having a good heatsink" ... in addition to the high consumption of the CPU and the lack of an additional 8-pin connector for power. It should also be noted that according to the same article, the heatsink used worsens the situation for some strange reason.
Ahhhh, since it's not AMD's mistake, it's not that important and the "journalist" is softening the news. Intel is really screwing up with this new chipset with extremely high temperatures, very high costs and really poor energy efficiency. But the one who writes the articles mostly criticizes everything that has to do with AMD.
This reminds me of when people complained that FX was too high a drain. Look where, now the tables have been turned hahaha
Not once is there a mention of the electricity bill or the advantages of the x299 platform in harsh winters.
The overclocking advice for two people who have been able to afford the platform is also appreciated.
Removing jokes and taunts either they take out gamma-segregated base plates or the platform will die in their hands.
Having a high consumption is equal to higher temperatures. Just the two things that fail on this platform (for now xD).
Is that the information does NOT speak of high consumption, but speaks of a deficiency of the motherboard manufacturers when developing heatsinks for the VRM that feed the processor, but of course, when you do not know what you are talking about, these pass things.
«According to der8auer, Skylake-X consumption consumes too much for a single 8-pin connector»… there it is, even so I agree that the problem directly lies with the motherboard manufacturers, although the origin apparently comes from the increased consumption, now ALL manufacturers did the same st... ieces??… what I don't understand and the article doesn't explain is how they made such an inefficient heatsink that even heats the VRMs even more??
This you have not interpreted well. It refers to the fact that the consumption of the processors, for a single connector, would be too much, which causes the requirement of more current (intensity). If there are more connectors, the current is shared and this can lower the temperatures, because the cables also get hot.
mmmm ... no, there is no attack on intel at all and as well as misinterpreting the consumption ... I don't think so, it's more! To my way of seeing things we agree that the manufacturers are responsible for the problem, the only thing I added is that Intel could also contribute to the consumption issue in addition to the fact that manufacturers must both improve the efficiency of the heatsinks and add an additional 8 connector lighter, a 24 and 8 + 8 power supply
Ale, quick to say that it is a failure of Intel, when the failure is in the development of the VRM phases of the motherboard, whose heatsink is not enough to dissipate the heat. How we like to attack Intel. I am sorry to tell you that you have been portrayed.