RAMBUS has presented preliminary data on the architectures of the HMB3 and DDR5 memories, which it expects to launch in 7nm and which they assure will arrive before 2019.

The current situation is one of significant shortage in the memory module market, which raises the price of RAM, SSDs and is already affecting graphics cards. Stock problems, due to the strong demand for NAND Flash memories from the smartphone market, are partly to blame, since the demand is high and there is no stock. Despite this, there are manufacturers that are already developing the memories of the future, in this case RAMBUS, which would already be working on the specifications for HBM3 memories and GDDR5 memories.

It is becoming more and more important to offer good bandwidth in modern computers, especially in heavy and complex tasks, such as those performed by graphics cards, for example. The HBM3 memories will be those that will replace the HBM2 and will offer twice the bandwidth of these memories, something that makes the HBM3 can be up to four times faster than the HBM1 memories. Regarding DDR5 memories, it is expected that the bandwidth will be increased by 1.5x / 2x, with respect to DDR4 memories, which means offering a new memory standard with higher performance than its predecessors.

RAMBUS indicates that both the HBM3 memories and the DDR5 memories will be manufactured under the 7nm process and they hope to have these standards ready for manufacturing before 2019. This date is quite optimistic, the truth is, even for 2019 it is optimistic and the logical term it will be for 2020, possibly. The HBM3 stands out above all, which will enhance the graphics, apparently, because at least the HBM2 in the AMD RX Vega, although they give good performance, it seems that in the end the general performance of the GPU is below expectations.

Source: OC3D