Samsung presented a few hours ago the world's first 5Gb DDR32 DRAM chip. This new memory chip is manufactured in the 12nm DRAM process and offers higher density with reduced power consumption. This chip will enable Samsung to manufacture record-breaking 1TB RDIMMs for servers and reduce the cost of high-capacity memory modules.
The 32Gb memory chips will allow Samsung to build a typical 32GB single-rank module for client PCs using just eight single-chip memory chips. They also allow you to create higher capacity DIMMs that were not possible before. 1TB memory modules are expected using 40 8-Hi 3DS memory stacks based on eight 32Gb memory devices.
Samsung may offer 1 GB modules for servers
You have to understand that they are expected to be used for servers, which recently see their workloads increased thanks to Artificial Intelligence, Big Data and databases. It is expected that 1 TB RDIMMs would allow up to 12 TB of memory in a single socket server.
In terms of power consumption, they are expected to consume 10% less power than current generation modules built on 16Gb dies. This drop in consumption can be attributed to both the 12nm DRAM production node and the fact of avoid using 3D stacked chips which pack two 16Gb dies into a single package.
Samsung has not revealed the speeds of its 32Gb memory chips. They intend to start mass production of 32Gb memory chips by the end of 2023. Although, most likely, it will take a long time to see these modules, if they are Expect them to have higher prices, and that it pays to use normal modules.
Source: Anandtech
