Images from the AMD Zen conference at the ISSCC, AMD Ryzen base, are leaked

Robert Sole 9 February, 2017

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New details on the AMD Zen architecture, the basis of the new AMD Ryzen processors, after leaking the slides used by AMD during the International Solid-State Circuits Conference (ISSCC).

During these days the International Solid-State Circuits Conference has been held. This for many means rather little, but it is an important event where the most important news about the development of products based on silicon and integrated circuits are presented. In this same conference is where a few days ago it was reported about the difference in the DIE between processors based on AMD Zen (architecture used for AMD Ryzen) and Intel Skylake. Through the Japanese medium PCWatch, we have obtained new information thanks to the filtering of the conference slides.

The ISSCC has been the means that AMD has used to reveal that the manufacturer of the Zen-based chips has been GlobalFoundries, with the 14nm FinFET manufacturing process. According to AMD itself, the Zen architecture is capable of offering an improvement in single-threaded performance and energy efficiency, compared to Intel Skylake. Among the great improvements of Zen is the LDO digital voltage regulator, which is responsible for controlling the voltages of each of the cores, improving consumption efficiency.

AMD has also highlighted the dimensions of the cores, which will have an area of only 7 mm² ^, while the four cores together will have a total surface area of 44 mm² ^. This indicates that AMD has achieved significant compression compared to Intel, since the total surface area of a quad-core processor in Skylake is 49 mm² ^. This translates into improvements in performance, power consumption, and heat generation.

As a curiosity we leave you all the slides that have been leaked about AMD Zen, which is the AMD Ryzen architecture, of which we already have a lot of data due to recent leaks. The most interesting thing is that AMD seems to have solved the problems of temperature and consumption of previous architectures, which is a very important achievement.