TSMC's 7nm node won't be leveraged until the second half of 2019, something that may benefit AMD

TSMC's reduction in processor production burden of its 7nm lithography could benefit AMD, which would have room for maneuver if its products sell well.

AMD is completely reliant on TSMC's 7nm lithography, which has been announced that it will not be fully usable in Q2019 2019. This lithography that will bring AMD's next-generation processors and GPUs to life, will not be fully operational until the second half of XNUMX. It will also affect Apple and Qualcomm, who await their high-end processors for smartphones.

TSMC will not have its 100nm lithography 7% operational until the second half of 2019.

Moving on to this lithography is very important, as currently 14nm and 16nm lithographs are mostly used for most of the chips manufactured by the Taiwanese silicon giant. The smallest jump to 12nm is completely insufficient and this gigantic jump will serve to deliver a significant leap in performance, density and energy efficiency.

According to media information Digitimes, TSMC's 7nm node is reported to be under-utilized during the first half of 2019, operating at 80-90% capacity. Qualcomm, Apple and HiSilicon have reduced the demand for products based on 7nm, due to the drop in demand for high-end smartphones.

This reduction in TSMC's burden for its new lithography may benefit AMD, which is currently relying on 7nm to increase the lead with Intel. Right now the company has a little more leeway on its hands to increase demand for silicon wafers should it be needed. ROME, the second generation EPYC, is expected to sell significantly, cutting Intel over 10% market share due to improved energy efficiency and increased performance thanks to 7nm.