TSMC announced the availability of the new 6nm lithograph, which will begin to be used in the first quarter of 2020.
The war of the nuclei has been between us for a long time, but now a much more curious one begins. Samsung, TSMC and Intel are the main foundries today, Intel being the one that is the most behind due to its problems with 10nm. Samsung has already said that it has finished developing the 5nm and a few days ago TSCM announced the 7nm EUV (N7 +). Well, the Taiwanese foundry announces the availability of 6nm lithography, called N6. It should be noted that by the end of 2020 they will have the 5nm ready.
TSMC Announces Availability of 6nm Lithography
This lithograph did not fit into any plan and appears to be a much improved 7nm process. According to the company, they want to take advantage of the Intellectual Property of their clients under 7nm and bring it to 6nm. They promise to do it in a very short time and at extremely low cost. According to TSMC this new lithography has a density of 18% more than 7nm. An improvement in consumption and performance is expected, but we do not know to what extent.
As they have commented, the start of the manufacture of chips in this lithograph will be in the first quarter of 2020. This will allow manufacturers of SoC for mobile, chips for AI, processors for networks, graphics or processors for servers, reduce costs.
"TSMC's N6 technology will further extend our leadership in delivering beneficial products with higher performance and cost advantages beyond the current N7," said Dr. Kevin Zhang, TSMC Vice President of Business Development.
"Building on the extensive success of our 7nm technology, we are confident that our customers will be able to quickly extract even greater product value from the new offering by leveraging a well-established design ecosystem today."
Source: Gizchina
